Qualcomm Announces New Platforms for 5G, Wi-Fi, and Bluetooth
Qualcomm today announced the X70 5G modem, S5 and S3 Sound Platforms for Bluetooth audio products, and FastConnect 7800 subsystem with Wi-Fi 7. The highlight of the X70 is a new set of AI processing technologies to improve modem performance. The X70 also include 4x downlink carrier aggregation, across TDD and FDD, sub-6 and mmWave. It also supports uplink carrier aggregation and switched uplink support across TDD and FDD. Qualcomm claims the X70 is the only solution capable of supporting every commercial 5G band in the world. It also supports standalone mmWave networks. The X70 has a upgradeable architecture "allowing rapid commercialization of 5G Release 16 features through software updates". The modem should make it into commercial devices by the end of the year, and it expected to be integrated into forthcoming Snapdragon SoC chips. Qualcomm's new chips for Bluetooth earbuds and similar products are the Qualcomm S5/S3 Sound Platform. These chips support new Bluetooth L...