MediaTek Aims to Power Flagship Phones with Dimensity 9000

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Chipmaker MediaTek has announced the Dimensity 9000, a high-powered, feature-rich SoC (system-on-chip) designed to be the heart of flagship-class phones. It's designed to compete with chips like Qualcomm's Snapdragon 888, and MediaTek claims it bests the 888 in a number of ways. It does not support mmWave 5G, which may limit its adoption in flagship phones with certain US carriers, most of all Verizon. The Dimensity 9000 is made using a cutting-edge 4nm manufacturing process for maximum efficiency. The CPU and GPU are based on Arm's new v9 architecture, with one Cortex X2 performance core, three Cortex A710 "big" cores, four Cortex A510 low-power cores, and Mali G710 MC10 for graphics. Other cores include a 6-core AI engine and an advanced triple ISP for imaging. The ISP can process input from three 32 megapixel cameras in real time, and supports triple-exposure HDR when capturing 4K video. The video engine can also encode 8K video and natively decode the new AV1 codec in 8K. The chip can drive full-HD displays at up to 180 Hz refresh, and higher-res displays at up to 144 Hz. The modem supports 5G release 16 features, including three-band carrier aggregation (CA) for download speeds up to 7 Gbps using only sub-6 bands (a world-first). The wireless features also include support for Bluetooth 5.3 (another world-first) with LE Audio, and Wi-Fi 6E. MediaTek's customers plan to ship phones using the Dimensity 9000 by the end of the first quarter 2022, starting in Asia and Europe.
http://dlvr.it/SCqVWj

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