Intel says it will stuff one trillion transistors into a package by 2030

Intel announced that it will be able to stuff one trillion transistors into an IC package by 2030.
http://dlvr.it/SdrtTR

Comments

Popular posts from this blog

Nothing is OnePlus co-founder Carl Pei's new consumer tech company

Best prepaid phone plans on the Verizon, T-Mobile, or AT&T networks

Google Fit Gains Heart Rate, Respiratory Rate Measurement via Camera