Qualcomm's Next 5G Modem Boosts Performance Across the Board

Qualcomm has announced the Snapdragon X75 Modem-RF System, the world's first to support 5G Advanced (3GPP release 18). It supports a number of new capabilities in the 5G standard that will improve maximum possible data speeds, and makes a number of other internal improvements to boost performance in various areas. It is the first chipset to support up to five carrier aggregation, and up to ten component carriers in mmWave. It is the first to support FDD+FDD carrier aggregation on the uplink, and FDD MIMO offers up to 50% better uplink throughput. The X75 supports more band combinations than ever, enabling more carrier aggregation (more bandwidth for higher speeds) on more networks. A new, simpler architecture (with a single transceiver for both sub-6 and mmWave) takes up 25% less space on circuit boards and offers 20% power savings. A new 2nd-generation AI processor includes the first Tensor accelerator in a 5G modem, and offers 2.5x the AI processing performance compared to the X70. The improved AI helps keep a stronger link on mmWave connections using beam management and new sensor input. It also brings up to 50% better GPS accuracy. 2nd-generation Smart Network Selection uses on-device learning to help the chip make smarter choices to maintain a connection in challenging areas such as elevators, parking garages, and subways. Naturally the X75 also supports Snapdragon Satellite technology announced recently at CES. The Snapdragon X75 is sampling now and the first X75-based devices should appear in the second half of 2023. The X75 will be integrated into the next flagship Snapdragon 8 chipset, expected in late 2023.
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