Qualcomm Intros Another Chip for Almost-Flagship Phones

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Qualcomm today announced the Snapdragon 7+ Gen 3 mobile platform, a chipset for high-end phones that are just below "flagship" class. This new chip sits just above the existing Snapdragon 7 Gen 3 in the lineup, and right below the just-announced Snapdragon 8s Gen 3. It brings a long list of improvements compared to last year's Snapdragon 7+ Gen 2 that it replaces. Among these are many firsts for the 7 series, such as on-device generative AI, dual NPU with INT4 precision for always-on AI sensing, a low-power ISP for Always-On Camera, cognitive triple 18-bit ISP, UFS 4.0 storage, support for up to 24 GB of RAM at up to 4,200 MHz, Wi-Fi 7 with HBS, Bluetooth 5.4 with dual antennas, and Frame Motion Engine 2.0 for double-frame-rate gaming. It also has 15% improved CPU and 45% improved GPU performance. It has an Arm Cortex-X4 prime core running at up to 2.8 GHz, 4 performance cores, and 3 efficiency cores. It uses a Snapdragon X63 modem (like the Snapdragon 7 Gen 3) and FastConnect 7800 for local radios (like the Snapdragon 8s Gen 3). Qualcomm expects phones using the Snapdragon 7+ Gen 3 to reach the market in the "coming months".


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